Systematic Memory Test Generation for DRAM Defects Causing Two Floating Nodes

نویسندگان

  • Zaid Al-Ars
  • Ad J. van de Goor
چکیده

The high complexity of the faulty behavior observed in DRAMs is caused primarily by the presence of internal floating nodes in defective DRAMs. This paper describes a new analysis method to apply electrical simulation for investigating the faulty behavior resulting from defects causing two floating nodes within the memory. The paper also presents the results of a simulation study performed on bit line opens to validate the newly proposed method, and suggests a test to detect these bit line opens.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

BIST: required for embedded DRAM

Introduction In the virtual component (VC) integration business, the embedded DRAM is a key VC to realize high bit density and high bandwidth performance, thus the low-cost testing of DRAM-integrated LSI is an emerged problem. The DRAM test usually includes a fail-bit (address) search to repair the memory cell defects with redundancy, requiring long time for wafer probing. A DRAM BIST drastical...

متن کامل

Layout-orientierte Fehleranalyse von Teilkomponenten einer DRAM-Schaltung Layout-Oriented Fault Analysis for DRAM Design Components

Semiconductor memory is one of the dominating parts in SoCs. Along with ROM, SRAM and flash memory, also DRAM elements take up a considerable amount of the chip’s silicon area. Hence, DRAM has significant impact on yield, quality and reliability of the complete SoC. It is well known the production test has become a major cost factor in the IC manufacturing process. To reduce these costs, effici...

متن کامل

A Three-Dimensional DRAM Using Floating Body Capacitance Cells in an FD-SOI Process

This paper describes a three-dimensional DRAM in which the floating body capacitance (FBC) of a fully depleted SOI (FD-SOI) device is used as a storage node. This 1T DRAM lends itself particularly well to a 3D waferto-wafer bonding process because of the absence of deep etched and filled trench capacitor structure, and the improved thickness control tolerance in wafer thinning. A novel three-ti...

متن کامل

Fault Models and Tests for a Prototype 4-level DRAM

This Diplomarbeit describes the development of a fault model and appropriate tests for a 4-level dynamic random-access memory (DRAM). The considered DRAM stores two bits in one cell using four signal voltage levels and three reference voltages. These voltage levels are created by charge sharing schemes which lead to sequential sensing and restore operations. Both operations are more complicated...

متن کامل

DRAM Specific Approximation of the Faulty Behavior of Cell Defects

To limit the exponential complexity required to analyze the dynamic faulty behavior of DRAMs, algorithms have been published to approximate the faulty behavior of DRAM cell defects. These algorithms, however, have limited practical application since they are based on generic memory operations (writes and reads) rather than the DRAM specific operations (activation, precharge, etc.). This paper e...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2003